All of our cPCI, VME and OpenVPX boards are designed for either air or conduction cooling. All boards also incorporate appropriate stiffening to ensure performance during shock and vibration and to assure reliable operation (lower fatigue stresses) over the service life of the product.
Parameters
|
Level |
1 / Commercial-AC (Air-Cooled) |
2 / Rugged-AC (Air-Cooled) |
3 / Rugged-CC (Conduction-Cooled) |
Temperature - Operating |
0ºC to +70ºC, Ambient H |
-40ºC to +85ºC, Ambient I |
-40ºC to +85ºC, at wedgelock thermal interace |
Temperature - Storage |
-40ºC to 85ºC |
-55ºC to 105ºC |
-55ºC to 105ºC |
Humidity - Operating |
0 to 95%, non-condensing |
0 to 95%, non-condensing |
0 to 95%, non-condensing |
Humidity - Storage |
0 to 95%, non-condensing |
0 to 95%, non-condensing |
0 to 95%, non-condensing |
Vibration - Sine A |
2 g peak, 15 Hz - 2 kHz B |
6 g peak, 15 Hz - 2 kHz B |
10 g peak, 15 Hz - 2 kHz C |
Vibration - Random D |
0.002 g2/Hz, 15 Hz - 2kHz |
0.04 g2/Hz, 15 Hz - 2 kHz |
0.1 g2/Hz, 15 Hz - 2kHz E |
Shock F |
20 g peak, half-sine, 11 ms |
30 g peak, half-sine, 11 ms |
40 g peak, half-sine, 11 ms |
Low Pressure G |
Up to 15,000 ft. |
Up to 50,000 ft. |
Up to 50,000 ft. |
Specifications subject to change without notice.
Notes:
A. Based on a sweep duration of ten minutes per axis, each of the three mutually perpendicular axes.
B. Displacement limited to 0.10 D.A. from 15 to 44 Hz.
C. Displacement limited to 0.436 D.A. from 15 to 21 Hz.
D. 60 minutes per axis each of the three mutually perpendicular axes.
E. Per MIL-STD-810G, Method 5.14.6 Procedure I, Fig.514.6C-6 Category 7 tailored (11.65 Grms): 15 Hz – 2 kHz; ASD (PSD) at 0.04 g2/Hz between 15 Hz - 150 Hz, increasing at 4 dB/octave from 0.04 g2/Hz to 0.1 g2/Hz between 150 Hz – 300 Hz, 0.1 g2/Hz between 300 Hz - 1000 Hz, decreasing at 6 dB/octave from 0.1 g2/Hz to 0.025 g2/Hz between 1000 Hz – 2000 Hz.
F. Three hits per direction per axis (total of 18 hits).
G. For altitudes higher than 50,000 ft. contact NAI.
H. High temperature operation requires 350 lfm minimum air flow across cover/heatsink (module dependent).
I. High temperature operation requires 600 lfm minimum air flow across cover/heatsink (module dependent).