VS2
Video System & Processing XMC
Introducing NAI's versatile video capture, compression, overlay-capable, and output XMC (Switched Mezzanine Card) form factor solution. At its core lies the powerful Multi-processor System On Chip (MPSoC) Zynq® UltraScale+™ EV with FPGA, boasting video-optimized hardware for unparalleled performance. Designed with PCIe x4 GEN3 connectivity and VITA 61 XMC Connectors, this board facilitates high-speed data transfer and optimized routing for digital video.
The VS2 is an XMC function module designed for high-performance advanced video processing capabilities applications. Equipped with 4x 3GSDI Ports, each programmable as either input or output, alongside 2x DisplayPort v.1.4 IN and 2x DisplayPort v.1.4 OUT interfaces, the board offers comprehensive connectivity options. Additionally, it features 2x RS-170 IN ports and 1x ARINC 818 OUT & 1x ARINC 818 IN ports, with the flexibility of Copper (default) or Fiber Optic (optional) configurations. The VS2 is suitable for integration into systems with XMC PCIe connectivity, requiring video input/output, and flexible configuration options.
Features
- Video Processing: The VS2 module offers advanced capabilities for real-time video stream capture, specifically designed to leverage the GPU processing performance of the host SBC, to provide overlay, image merge or other manipulation algorithms.
- PCIe Connectivity: Equipped with a PCIe x4 Gen3 interface, the module ensures high-speed data transfer between the VS2 and the host system.
- SDI Interface: Featuring four 3G SDI ports, the module supports both SDI input and output functionalities. These ports are field programmable/configurable, allowing flexible configuration based on application requirements.
- Hardware Accelerated Video Encode/Decode: H.264/265 Video Compression/Decompression Codec
- RS 170 Inputs: Two RS 170 inputs are provided, enabling analog video signal input for compatibility with legacy systems and devices.
- Display Port Input: The VS2 module features two Display Port v1.4 input ports, facilitating high-resolution video input from compatible sources
- Display Port Output: Additionally, two Display Port v1.4 output ports are available, enabling the transmission of proceed video signals to external display devices.
- ARINC 818 Interface: The module includes one ARINC 818 input and one ARINC 818 output interface(s), which can be configured for either copper of fiber optic communication. This interface supports high-speed, reliable data transmission, making it suitable for aerospace and avionics applications (pending option, as required, contact factory).
- Graphics Processor: Multi-processor System On Chip (MPSoC) IC Zynq® UltraScale+™ XCZU7EV-FFVC1156-2-I
- Interface: XMC 2.0 (VITA 61); 4 Lane PCIe 3.0
- Graphic Memory: 8 GB DDR4 SDRAM (PS) and 1 GB DDR4 SDRAM (PL); MPSoC: compression/decompression tasks, local housekeeping, bare metal/setup functions
- Video Outputs: 4x 3GSDI Ports Cumulative (programmable as Input or Output); 2x DisplayPort v.1.4; 1x ARINC 818 OUT (Cu or FO); Noted: ARINC 818 includes video data, frame header, container header, ancillary data, and video data.
- Video Inputs: 4x 3GSDI Ports Cumulative (programmable as Input or Output); 2x DisplayPort v.1.4; 2x RS-170 IN; 1x ARINC 818 Input (Cu or FO); Noted: ARINC 818 includes video data, frame header, container header, ancillary data, and video data.
- Hardware Accelerated Video Encode/Decode: H.264 Hardware Decoder UVD 4.0 (Unified Video Decoder); H.264 Hardware Encoder VCE 1.0 (Video Codec Engine); Noted: UVD and VCE; supports AVC and HEVC with specific profiles as mentioned in AMD/Xilinx PG252 that are compliant to GStreamer (OpenMAX) framework.
- Power: +12V and +3.3V_AUX only; 25 W (Estimated, TBD)
- Ground: Module is system ground referenced.
- Weight: 4 oz. (113 g), approx. w/ integrated heatsink
- NAI Ruggedization Level 3-CC: Designed to meet the testing requirements of MIL-STD-810 when installed on an appropriate XMC carrier. Temp Operating: -40ºC to +85ºC at XMC thermal transfer interface; Humidity Operating: 0 to 95%, non-condensing; Vibration: to 0.1 g2/Hz (see profile); Shock: 40 g peak
- *: Pending design verifications, characterizations, and qualification. Specifications and functionality definitions are subject to change.
7/23/2024 11:23:03 AM
NAI’s Configurable Open Systems Architecture™ (COSA®) offers a choice of over 100 smart I/O, communication, and Ethernet switch functions, providing the highest package density and greatest flexibility of any multifunction I/O board in the industry. Preexisting, fully-tested functions can be combined quickly and easily in an unlimited number of ways. Choose the ideal platform for your application below. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.
Related COSA® Products
Sensor Interface Units
North Atlantic's resource center is where you will find information on warranty and repairs, details of our Product Lifecycle Management and Configuration Management programs – and much more.
Visit Resource Center