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3U cPCI High Density I/O & Comm Board

One I/O and communication function module slot—
A variety of modules to choose from

NAI’s 75D4 is a 3U cPCI High-Density I/O and Communication Board with a single, high-density function module slot. In addition, the motherboard also includes an option for an integrated four-channel RS232/423/422/485 serial communication complement. This low-power/high-performance board is ideally suited for rugged defense, commercial aerospace, and industrial applications.

  • 3U cPCI board with PCI Bus Master capability
  • Support for one, high-density, function module with up to 48 I/O channels
  • A variety of high-density, I/O and communication modules to choose from
  • 4 integrated RS232/422/423/485 serial ports (optional)
  • Control via PCI Bus or dual Gigabit Ethernet (Gig-E) interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-In-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, -40° C to +85° C rugged

Block Diagram

The 75D4 includes SSKs to support multiple operating systems. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.

Accelerate Your Time-to-Mission™ With COSA®

NAI’s Configurable Open Systems Architecture™ (COSA®) offers a choice of over 70 smart I/O, communication, and Ethernet switch functions, providing the highest packaging density and greatest flexibility of any multifunction I/O board in the industry. Preexisting, fully-tested functions can be combined quickly and easily in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

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