75D4
3U cPCI High Density I/O & Comm Board
One I/O and communication function module slot—
A variety of modules to choose from
NAI’s 75D4 is a 3U cPCI High-Density I/O and Communication Board with a single, high-density function module slot. In addition, the motherboard also includes an option for an integrated four-channel RS232/423/422/485 serial communication complement. This low-power/high-performance board is ideally suited for rugged defense, commercial aerospace, and industrial applications.
Features
- 3U cPCI board with PCI Bus Master capability
- Support for one, high-density, function module with up to 48 I/O channels
- A variety of high-density, I/O and communication modules to choose from
- 4 integrated RS232/422/423/485 serial ports (optional)
- Control via PCI Bus or dual Gigabit Ethernet (Gig-E) interfaces
- Connections via front panel, rear panel, or both
- Automatic Background Built-In-Test (BIT) (module dependent)
- Software Support Kits (SSKs) and drivers available
- Commercial and rugged models
- Operating temperature: 0° C to 70° C commercial, -40° C to +85° C rugged
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The 75D4 includes SSKs to support multiple operating systems. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.
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NAI’s Configurable Open Systems Architecture™ (COSA®) offers a choice of over 70 smart I/O, communication, and Ethernet switch functions, providing the highest packaging density and greatest flexibility of any multifunction I/O board in the industry. Preexisting, fully-tested functions can be combined quickly and easily in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.
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